UWIN is eager to support your needs in semiconductor consumables and production equipment.

List of service and product

Dicing Tape and Back Grinding Tape

High function tapes used for production in semiconductor and electrical component. UV type, None UV type is available depending on the process.
- Tapes for wafer dicing.
- Tapes for package dicing.
- BG tape
- Denka Eleglip Tape

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Antistatic device for pure water

It is an equipment to control the resistivity value of ultra-pure water by a method in which carbon dioxide gas is fed through Hollw fiver gas permeation membranes.
- A range of models with treated water capacities to meet your needs, from 16L/min to 116L/min.
- Built-in inverter pump allows adjustment of treated water pressure (specialised models).
- DIC eFlow series

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Semiconductor related equipment and parts

- Tape mounters (dicing tape)
- Tape laminators and tape peeling machines (BG tape)
- UV irradiation machines (high-pressure mercury lamps, LED lamps, black lamps)
- Spin washers
- Wafer sorters
- Please consult us about modifications to existing equipment and maintenance parts.

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Grinding, Dicing and Reclaimed Wafer Processing service

- Grinding
- Polishing (dry polishing/CMP)
- Cutting (dicing)
- Pick-up - Tray filling - Inspection
- Available for various materials such as silicon wafers, SiC wafers and glass.

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Dicing Blade, Grinding Wheel

- Grinding wheels for Si wafers: low-damage grinding
- SiC wafer grinding wheels: low-damage grinding / ultra-thin finish grinding
- Dicing blades: metal bond / resin bond / electroformed bond
- Hub blades
- High-quality processing blades: polyimide bond / vitrified bond

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Dummy package/ Silicon wafer

We can provide small lot of dummy wafers and QFN used for evaluation purposes.
Pls. contact us for any other supports you may require.